TR7700 SIII DT是一臺高性能(neng)的(de)離線(xian)型AOI解決方案，擁有精(jing)度(du)高和(he)易用性等(deng)優(you)點(dian)。使用TRI多相(xiang)位光源和(he)新一代的(de)檢測軟件，TR7700 SIII DT具備快速(su)和(he)簡易編(bian)程(cheng)等(deng)優(you)良的(de)缺陷檢測功能(neng)，非常(chang)適合變化(hua)度(du)高生產(chan)線(xian)。
特點● 為爐(lu)前/爐(lu)后檢(jian)測(ce)之精度高離線型AOI解決(jue)方案(an)
● 快速、易編程且符合IPC標準規范
● 優良的(de)演(yan)算法和多相(xiang)位光源將誤判降(jiang)至最低.
規格：
| Optical System/光學系統 | |
| Imaging Method/成像方法 | Dynamic Imaging/動態成像 |
| Top Camera | 4 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 10 μm, 15 μm (factory setting) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | N/A |
| Max. 3D Range | N/A |
| Inspection Performance/檢驗性能 | |
| Imaging Speed | 4 Mpix@ 10 μm: 60 cm2/sec |
| 4 Mpix@ 12.5 μm: 120 cm2/sec | |
| Motion Table & Control/運動表和控件 | |
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 μm |
| Board Handling/板處理 | |
| Max PCB Size | TR7700 SIII DT: 330 x 250 mm |
| TR7700L SIII DT: 510 x 460 mm | |
| PCB Thickness | 3 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm [48 mm optional] |
| Bottom Clearance | TR7700 SIII DT: 100 mm |
| TR7700L SIII DT: 50 mm | |
| Edge Clearance | 3 mm |
| Conveyor | Manual |
| Inspection Functions/檢查功能 | |
| Component | Missing |
| Tombstoning | |
| Billboarding | |
| Polarity | |
| Rotation | |
| Shift | |
| Wrong Marking (OCV) | |
| Defective | |
| Upside Down | |
| Extra Component | |
| Foreign Material | |
| Solder | Excess Solder |
| Insufficient Solder | |
| Bridging | |
| Through-hole Pins | |
| Lifted Lead | |
| Golden Finger | |
| Scratch/Contamination | |
| Dimensions/尺寸 | |
| WxDxH | TR7700 SIII DT: 860 x 1100 x 1350 mm |
| TR7700L SIII DT: 980 x 1345 x 1490 mm | |
| Weight | TR7700 SIII DT: 340 kg |
| TR7700L SIII DT: 385 kg | |
